Ultra RM Converter 2.1.8 Serial Crack
AlGaN/GaN HFET-based ultra-high-frequency power devices [ 115 ] are ideally suited for low-voltage applications (2.5 - 5 V) in a wide range of applications such as light sources [ 116, 117 ], lighting systems [ 118, 119 ], logic [120 ], automotive [121 ], communication [122, 123 ], and grid stabilization [124, 125 ]. On the other hand, device-based power converters are subjected to spurious current and voltage noise from adjacent switching circuits. This results in self- and cross-talk between switching ICs which impedes high-frequency, low-cost and energy-efficient circuit design and integration.
Ultra RM Converter 2.1.8 Serial Crack
Simulations of the structural and electrical properties of ultra-high-frequency GaN HFETs were performed using a combination of electromagnetic fields equations, Fermi level dependent band-to-band tunneling and quantum mechanical [126 ]. The results were then validated by both theoretical and experimental characterization techniques. The model predictions were highly reliable and revealed a significant amount of fabricated GaN HFETs as n-doped (up to 1018 cm-2) with lateral dimensions less than 1 m. The model shows that the key figure-of-merit for GaN-HFETs in the context of ultra-high-frequency monolithic power integrated circuits is the CG, whereas the conduction band offset is of secondary importance. The results also show that the peak 2DEG density can be kept nearly constant and independent of the doping level at 2 V. The model predictions have been validated by measuring the current-voltage characteristics of three different devices of identical geometry. The room-temperature average values of the output power were measured as 0.1 mW, 16 mW, and 14 mW, respectively, showing that the key figure-of-merit is the average gate current that correlates to the power density. Further, on-state current and peak-to-valley transconductance were measured and exceeded values of 50 mA and 10 mS. All results demonstrate that the proposed device model is capable of predicting the performance of fabricated devices. The results are essential for understanding and future fabrication of ultra-high-frequency, low-cost, and compact power integrated circuits.